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| (R) SMP50 / SMTPA / TPA TRISILTM FOR TELECOM EQUIPMENT PROTECTION FEATURES Bidirectional crowbar protection Voltage range from 62V to 270V Low capacitance from 12pF to 20pF @ 50V Low leakage current : IR = 2A max Holding current: IH = 150 mA min Repetitive peak pulse current : IPP = 50 A (10/1000s) MAIN APPLICATIONS Telecommunication equipment such as: SMA (JEDEC DO-214AC) SMP50 SMB (JEDEC DO-214AA) SMTPA Analog and digital line cards (xDSL, T1/E1, ISDN, ...) Terminals (phone, fax, modem, ...) and central office equipment DO-15 TPA DESCRIPTION These Trisil series have been designed to protect telecommunication equipment against lightning and transient induced by AC power lines. They are available in SMA, SMB and DO-15 packages. BENEFITS Trisils are not subject to ageing and provide a fail safe mode in short circuit for a better protection. They are used to help equipment to meet various standards such as UL1950, IEC950 / CSA C22.2, UL1459 and FCC part 68. Trisils have UL94 V0 approved resin. SMA and SMB packages are JEDEC registered (DO-214AC and DO-214AA). Trisils are UL497B approved (file: E136224). Table 1: Order Codes Part Number SMP50-xxx TPAxxx SMTPAxxx Figure 1: Schematic Diagram Marking See page 9 November 2004 REV. 1 1/10 SMP50 / SMTPA / TPA Table 2: In compliances with the following standards STANDARD GR-1089 Core First level GR-1089 Core Second level GR-1089 Core Intra-building ITU-T-K20/K21 ITU-T-K20 (IEC61000-4-2) VDE0433 VDE0878 IEC61000-4-5 FCC Part 68, lightning surge type A FCC Part 68, lightning surge type B Peak Surge Voltage (V) 2500 1000 5000 1500 6000 1500 8000 15000 4000 2000 4000 2000 4000 4000 1500 800 1000 Waveform Voltage 2/10 s 10/1000 s 2/10 s 2/10 s 10/700 s 1/60 ns 10/700 s 1.2/50 s 10/700 s 1.2/50 s 10/160 s 10/560 s 9/720 s Required peak current (A) 500 100 500 100 150 37.5 Current waveform 2/10 s 10/1000 s 2/10 s 2/10 s 5/310 s Minimum serial resistor to meet standard () 20 10 40 0 53 0 0 0 21.5 0 0 0 21.5 0 12.5 6.5 0 ESD contact discharge ESD air discharge 100 50 100 50 100 100 200 100 25 5/310 s 1/20 s 5/310 s 8/20 s 10/160 s 10/560 s 5/320 s Table 3: Absolute Ratings (Tamb = 25C) Symbol IPP Parameter Repetitive peak pulse current (see figure 2) 10/1000 s 8/20 s 10/560 s 5/310 s 10/160 s 1/20 s 2/10 s 8/20 s t = 0.2 s t=1s t=2s t = 15 mn t = 16.6 ms t = 20 ms Value 50 100 55 65 75 100 100 2.5 16 11.5 10 3.5 6.2 6.5 -55 to 150 150 260 Unit A IFS ITSM Fail-safe mode : maximum current (note 1) Non repetitive surge peak on-state current (sinusoidal) kA A I2t Tstg Tj TL I2t value for fusing Storage temperature range Maximum junction temperature Maximum lead temperature for soldering during 10 s. A2s C C Note 1: in fail safe mode, the device acts as a short circuit 2/10 SMP50 / SMTPA / TPA Table 4: Thermal Resistances Symbol Rth(j-a) Rth(j-l) Parameter Junction to ambient (with recommended footprint or with Llead = 10mm for DO-15) Junction to leads (Llead = 10mm for DO-15) DO-15 100 60 Value SMA 120 30 SMB 100 20 Unit C/W C/W Table 5: Electrical Characteristics (Tamb = 25C) Symbol VRM VBR VBO IRM IPP IBO IH VR IR C Parameter Stand-off voltage Breakdown voltage Breakover voltage Leakage current Peak pulse current Breakover current Holding current Continuous reverse voltage Leakage current at VR Capacitance Dynamic Static VBO VBO @ IBO max. max. max. note 2 note 3 IRM @ VRM Types max. A SMP50-62 / TPA62 SMTPA62 SMP50-68 / TPA68 SMTPA68 SMP50-100 / TPA100 SMTPA100 SMP50-120 / TPA120 SMTPA120 SMP50-130 / TPA130 SMTPA130 SMP50-180 / TPA180 SMTPA180 SMP50-200 / TPA200 SMTPA200 SMP50-220 / TPA220 SMTPA220 SMP50-240 / TPA240 SMTPA240 SMP50-270 / TPA270 SMTPA270 Note 1: Note 2: Note 3: IR @ VR max. note1 IH min. note 4 C typ. note 5 C typ. note 6 V 56 61 90 108 117 A V 62 68 100 120 130 V 85 93 135 160 173 235 262 285 300 350 V 82 90 133 160 173 mA mA pF 20 20 16 16 14 pF 40 40 35 30 30 25 25 25 25 25 2 162 180 198 216 243 5 180 200 220 240 270 240 267 293 320 360 800 150 14 12 12 12 12 IR measured at VR guarantee VBR min VR see functional test circuit 1 see test circuit 2 Note 4: see functional holding current test circuit 3 Note 5: VR = 50V bias, VRMS=1V, F=1MHz Note 6: VR = 2V bias, VRMS=1V, F=1MHz 3/10 SMP50 / SMTPA / TPA Figure 2: Pulse waveform (10/1000s) Figure 3: Non repetitive surge peak on-state current versus overload duration ITSM(A) 30 25 20 15 10 5 F=50Hz % I PP 100 Repetitive peak pulse current tr = rise time (s) tp = pulse duration time (s) 50 0 tr tp t t(s) 0 1E-2 1E-1 1E+0 1E+1 1E+2 1E+3 Figure 4: On-state voltage versus on-state current (typical values) IT(A) 50 Figure 5: Relative variation of holding current versus junction temperature IH[Tj] / IH[Tj=25C] 2.0 1.8 20 Tj=25C 1.6 1.4 10 1.2 1.0 5 0.8 0.6 2 0.4 VT(V) 1 0 1 2 3 4 5 6 7 8 9 10 0.2 0.0 -40 -20 0 20 Tj(C) 40 60 80 100 120 Figure 6: Relative variation of breakover voltage versus junction temperature VBO[Tj] / VBO[Tj=25C] 1.10 Figure 7: Relative variation of leakage current versus reverse voltage applied (typical values) IRM[Tj] / IRM[Tj=25C] 2000 1000 VR=VRM 1.05 100 1.00 270 V 10 0.95 62 V Tj(C) 0.90 -40 -20 0 20 40 60 80 100 Tj(C) 1 25 50 75 100 125 4/10 SMP50 / SMTPA / TPA Figure 8: Variation of thermal impedance junction to ambient versus pulse duration (Printed circuit board FR4, SCu=35m, recommended pad layout) Zth(j-a)(C/W) 1E+2 2.5 Tj=25C F=1MHz VRMS=1V Figure 9: Relative variation of junction capacitance versus reverse voltage applied (typical values) C[VR] / C[VR=50V] 2.0 SMTPA / TPA 1E+1 1.5 SMP50 1.0 1E+0 0.5 tp(s) 1E-1 1E-3 1E-2 1E-1 1E+0 1E+1 1E+2 5E+2 0.0 1 2 5 10 VR(V) 20 50 100 300 Figure 10: Test circuit 1 for Dynamic IBO and VBO parameters 100 V / s, di /dt < 10 A / s, Ipp = 50 A 2 45 66 470 83 0.36 nF 46 H U 10 F KeyTek 'System 2' generator with PN246I module 1 kV / s, di /dt < 10 A / s, Ipp = 10 A 26 H 250 12 47 46 H U 60 F KeyTek 'System 2' generator with PN246I module 5/10 SMP50 / SMTPA / TPA Figure 11: Test circuit 2 for IBO and VBO parameters K ton = 20ms R1 = 140 R2 = 240 220V 50Hz Vout DUT VBO measurement 1/4 IBO measurement TEST PROCEDURE Pulse test duration (tp = 20ms): for Bidirectional devices = Switch K is closed for Unidirectional devices = Switch K is open VOUT selection: Device with VBO < 200V VOUT = 250 VRMS, R1 = 140 Device with VBO 200V VOUT = 480 VRMS, R2 = 240 Figure 12: Test circuit 3 for dynamic IH parameters R Surge generator VBAT = - 48 V D.U.T This is a GO-NOGO test which allows to confirm the holding current (IH) level in a functional test circuit. TEST PROCEDURE 1/ Adjust the current level at the IH value by short circuiting the AK of the D.U.T. 2/ Fire the D.U.T. with a surge current IPP = 10A, 10/1000s. 3/ The D.U.T. will come back off-state within 50ms maximum. 6/10 SMP50 / SMTPA / TPA Figure 13: Ordering Information Scheme SMP Series SMP = Trisil surface mount in SMA SMTP = Trisil surface mount in SMB TP = Trisil in DO-15 Repetitive Peak Pulse Current A or 50 = 50A Voltage 62 = 62V 50 - xxx Figure 14: SMA Package Mechanical Data E1 DIMENSIONS REF. D Millimeters Min. Max. 2.03 0.20 1.65 0.41 5.60 4.60 2.95 1.60 1.90 0.05 1.25 0.15 4.80 3.95 2.25 0.75 Inches Min. 0.075 0.002 0.049 0.006 0.189 0.156 0.089 0.030 Max. 0.080 0.008 0.065 0.016 0.220 0.181 0.116 0.063 A1 A2 b E c E A1 E1 C L A2 D b L Figure 15: Foot Print Dimensions (in millimeters) 1.65 1.45 2.40 1.45 7/10 SMP50 / SMTPA / TPA Figure 16: SMB Package Mechanical Data DIMENSIONS E1 REF. D Millimeters Min. Max. 2.45 0.20 2.20 0.41 5.60 4.60 3.95 1.60 1.90 0.05 1.95 0.15 5.10 4.05 3.30 0.75 Inches Min. 0.075 0.002 0.077 0.006 0.201 0.159 0.130 0.030 Max. 0.096 0.008 0.087 0.016 0.220 0.181 0.156 0.063 A1 A2 b E c E A1 E1 C L A2 D b L Figure 17: Foot Print Dimensions (in millimeters) 2.3 1.52 2.75 1.52 Figure 18: DO-15 Package Mechanical data DIMENSIONS C A C REF. A B C Millimeters Min. 6.05 2.95 26 0.71 Max. 6.75 3.53 31 0.88 Inches Min. 0.238 0.116 1.024 0.028 Max. 0.266 0.139 1.220 0.035 D B D 8/10 SMP50 / SMTPA / TPA Table 6: Ordering Information Part Number SMP50-62 SMP50-68 SMP50-100 SMP50-120 SMP50-130 SMP50-180 SMP50-200 SMP50-220 SMP50-240 SMP50-270 SMTPA62 SMTPA68 SMTPA100 SMTPA120 SMTPA130 SMTPA180 SMTPA200 SMTPA220 SMTPA240 SMTPA270 TPA62 TPA62RL TPA68 TPA68RL TPA100 TPA100RL TPA120 TPA130 TPA130RL TPA180 TPA180RL TPA200 TPA200RL TPA220 TPA220RL TPA240 TPA240RL TPA270 TPA270RL Marking V06 V07 V10 V12 V13 V18 V20 V22 V24 V27 U01 U05 U13 U17 U19 U25 U27 U31 U35 U39 TPA62 TPA68 TPA100 TPA120 TPA130 TPA180 TPA200 TPA220 TPA240 TPA270 DO-15 0.40 g Package Weight Base qty Delivery mode SMA 0.068 g 5000 Tape & reel SMB 0.11 g 2500 Tape & reel 1000 6000 1000 6000 1000 6000 1000 1000 6000 1000 6000 1000 6000 1000 6000 1000 6000 1000 6000 Ammopack Tape & reel Ammopack Tape & reel Ammopack Tape & reel Ammopack Ammopack Tape & reel Ammopack Tape & reel Ammopack Tape & reel Ammopack Tape & reel Ammopack Tape & reel Ammopack Tape & reel Table 7: Revision History Date 16-Nov-2004 Revision 1 Description of Changes SMP50, SMTPA and TPA datasheets merge. 9/10 SMP50 / SMTPA / TPA Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners (c) 2004 STMicroelectronics - All rights reserved STMicroelectronics group of compagnies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 10/10 |
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